{"id":2728,"date":"2025-09-20T00:37:08","date_gmt":"2025-09-19T16:37:08","guid":{"rendered":"https:\/\/gp-line.com\/products\/glass-core-substrate"},"modified":"2025-10-23T00:25:59","modified_gmt":"2025-10-22T16:25:59","slug":"glass-core-substrate","status":"publish","type":"product","link":"https:\/\/gp-line.com\/en\/products\/glass-core-substrate","title":{"rendered":"Glass Core Substrate"},"content":{"rendered":"<div class=\"editorBlock\">\n<div class=\"faqItem_body\">\n<div class=\"content-box\">\n<h2><span style=\"color: #157ac0;\"><strong>Glass Core \u00a0<\/strong><\/span><\/h2>\n<p>The excellent high frequency electrical characteristics and low cost for glass. Glass interposer plays a key part in 3D integrated passive components, MEMS packaging, embedded fan-out, and multichip package.<br \/>\nGroup up is the leading company for providing equipment for TGV and SAP processes which are important processes to manufacture glass core substrate.<\/p>\n<p><img decoding=\"async\" src=\"\/_i\/assets\/upload\/images\/image_2024_03_22T07_04_14_113Z.png\" alt=\"\" \/><\/p>\n<hr \/>\n<h2><span style=\"color: #157ac0;\"><strong>TGV process flow\u00a0<\/strong><\/span><\/h2>\n<p>Specifications:<br \/>\nSize : 510mm x 515mm<br \/>\nThickness : 200um \u2013 1800um<br \/>\n<img decoding=\"async\" src=\"\/_i\/assets\/upload\/images\/image_2024_03_22T07_07_13_408Z.png\" alt=\"\" \/><\/p>\n<p><img decoding=\"async\" src=\"\/_i\/assets\/upload\/images\/image_2024_03_22T07_08_02_558Z.png\" alt=\"\" \/><\/p>\n<hr \/>\n<h2><span style=\"color: #157ac0;\"><strong>SAP process flow<\/strong><\/span><\/h2>\n<p>Specifications:<br \/>\nSize : 510mm x 515mm<br \/>\nThickness : 200um \u2013 1800um<br \/>\n<img decoding=\"async\" src=\"\/_i\/assets\/upload\/images\/image_2024_03_22T07_09_13_736Z.png\" alt=\"\" \/><\/p>\n<p><img decoding=\"async\" src=\"\/_i\/assets\/upload\/images\/803.jpg\" alt=\"\" \/><\/p>\n<\/div>\n<\/div>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>Glass Core \u00a0 The excellent high frequency electrical characteristics and low cost for glass. Glass interposer plays a key part in 3D integrated passive components, MEMS packaging, embedded fan-out, and multichip package. Group up is the leading company for providing equipment for TGV and SAP processes which are important processes to manufacture glass core substrate. [&hellip;]<\/p>\n","protected":false},"featured_media":2729,"template":"","meta":{"_acf_changed":false},"product_brand":[],"product_cat":[209],"product_tag":[],"class_list":["post-2728","product","type-product","status-publish","has-post-thumbnail","product_cat-glass-substrate-tgv","first","instock","shipping-taxable","product-type-simple"],"acf":[],"jetpack_sharing_enabled":true,"_links":{"self":[{"href":"https:\/\/gp-line.com\/en\/wp-json\/wp\/v2\/product\/2728","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/gp-line.com\/en\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/gp-line.com\/en\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/gp-line.com\/en\/wp-json\/wp\/v2\/media\/2729"}],"wp:attachment":[{"href":"https:\/\/gp-line.com\/en\/wp-json\/wp\/v2\/media?parent=2728"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/gp-line.com\/en\/wp-json\/wp\/v2\/product_brand?post=2728"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/gp-line.com\/en\/wp-json\/wp\/v2\/product_cat?post=2728"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/gp-line.com\/en\/wp-json\/wp\/v2\/product_tag?post=2728"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}