Glass Core
The excellent high frequency electrical characteristics and low cost for glass. Glass interposer plays a key part in 3D integrated passive components, MEMS packaging, embedded fan-out, and multichip package.
Group up is the leading company for providing equipment for TGV and SAP processes which are important processes to manufacture glass core substrate.
TGV process flow
Specifications:
Size : 510mm x 515mm
Thickness : 200um – 1800um
SAP process flow
Specifications:
Size : 510mm x 515mm
Thickness : 200um – 1800um
