Exhibition Activities
2026-01-01
2026 HKPCA SHOW
2026/12/2~12/4
Shenzhen World Exhibition & Convention Center (Bao’an), China
BOOTH:
2026 SEMICON SOUTHEAST ASIA
2026/5/5~5/7
Malaysia International Trade & Exhibition Centre (MITEC), Kuala Lumpur, Malaysia
BOOTH:
2026 SEMICON /FPD CHINA
2026/3/25~3/27
Shanghai New International Expo Centre (SNIEC)
BOOTH:
2026 CPCA SHOW
2026/3/24~3/26
National Exhibition and Convention Center（Shanghai）
BOOTH:
According to Yole Group Report, FOPLP is growing 27.3% CAGR2024-2030 with growing needs of AI and satellite markets. Laminator is an essential equipment in producing
s semiconductor technology continues to evolve, advanced packaging technologies such as Fan-Out Panel-Level Packaging (FO PLP) and Through-Glass Via (TGV) processes for glass IC substrates have become key directions for the future. Compared to Fan-Out Wafer-Level Packaging (FO WLP), the square panel format of FO PLP effectively reduces production costs.
Dip coater is a new technology for microscale and nanoscale coating and Group up has been researched this technology for more than a decade. Preparing