As semiconductor technology continues to evolve, advanced packaging technologies such as Fan-Out Panel-Level Packaging (FO PLP) and Through-Glass Via (TGV) processes for glass IC substrates have become key directions for the future. Compared to Fan-Out Wafer-Level Packaging (FO WLP), the square panel format of FO PLP effectively reduces production costs. In these processes, Group Up Industrial Co., Ltd. has invested heavily in R&D and testing for the lamination process, developing a variety of laminators tailored to different materials. This effort effectively addresses production bottlenecks, ensuring high product quality.
In both FO PLP and glass substrate TGV processes, it is crucial to ensure that core materials, such as dry film or protective film, are uniformly applied to IC substrates and glass IC substrates. Group Up Industrial has conducted extensive lamination tests, not only helping customers clarify implementation concerns but also identifying optimal parameters for compatible materials. High-precision lamination prevents defects such as bubbles and foreign particles, enhancing overall process stability and product reliability.
With its high transparency and low thermal expansion coefficient, the glass substrate is gaining significant attention for future AI and data center applications.
