According to Yole Group Report, FOPLP is growing 27.3% CAGR2024-2030 with growing needs of AI and satellite markets. Laminator is an essential equipment in producing FOPLP products. Group Up Industrial Co., LTD (Group Up) provides wafer ABF laminator, dry film laminator, heat release film & laser release film laminator and

s semiconductor technology continues to evolve, advanced packaging technologies such as Fan-Out Panel-Level Packaging (FO PLP) and Through-Glass Via (TGV) processes for glass IC substrates have become key directions for the future. Compared to Fan-Out Wafer-Level Packaging (FO WLP), the square panel format of FO PLP effectively reduces production costs.

Dip coater is a new technology for microscale and nanoscale coating and Group up has been researched this technology for more than a decade. Preparing for the AI era, together with the rapid development of glass substrate and glass interposer; the need of achieving higher aspect ratio of through-hole vias

Group Up, an industrial oven supplier with a leading position in the global IC substrate market, is well aware that global enterprises are paying more attention to environmental protection, energy conservation and carbon reduction, and we continue to study the issue of energy conservation and carbon reduction. Group Up’s ovens

Group Up Industrial, an industrial machine supplier with more than 30 years of experience in PCB, FPC, and IC substrate fields, is aware that the manufacturing industry is gradually moving towards digital transformation, in which MES systems have become an important role in intelligent machines. MES systems provide real-time monitoring

Industrial oven supplier “Group Up” has a quality-first spirit and focus on improving every detail of the oven to provide customers with a better product. The new ventilation adjustment system is an innovative highlight in industrial ovens in 2024.