FO WLP/PLP Process
Source from:
Tanja Braun, Karl-Friedrich Becker, Ole Hoelck, Steve Voges, Ruben Kahle, Marc Dreissigacker and Martin , Schneider-Ramelow
“Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration”, Micromachines 2019, 10, 342
Laminator
• Dry Films
• Molding Films
• Dielectric Films (ABF, PSPI…)
• Releasable Temporary Bonding Films
Oven
• Pre-bake
• Post-bake
• PEB
• Annealing
• Thermal debonding
Coater
• Spray Coating
• Roller Coating
• Die Coating
UV
• UV bumping
• UV curing