FO WLP/PLP

FO WLP/PLP Process

Source from:
Tanja Braun, Karl-Friedrich Becker, Ole Hoelck, Steve Voges, Ruben Kahle, Marc Dreissigacker and Martin , Schneider-Ramelow
“Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration”, Micromachines 2019, 10, 342

Laminator

•    Dry Films
•    Molding Films
•    Dielectric Films (ABF, PSPI…)
•    Releasable Temporary Bonding Films

Oven

•    Pre-bake
•    Post-bake
•    PEB
•    Annealing
•    Thermal debonding

Coater

•    Spray Coating
•    Roller Coating
•    Die Coating

UV

•    UV bumping
•    UV curing