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PCB and IC Substrate
TGV and Advance Packaging
LCD and Optical Process
FPC and Roll to Roll
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Exhibition Activities
News Release
Investor
Financial Information
Monthly Revenue
Quarterly Results
Annual Reports
Shareholder Column
Shareholders Meeting Related
Annual Report of Shareholders Meeting
Corporate Briefing Session
Major Shareholders List
Corporate Governance
Board of Directors and Functional Committees
Board of Directors
Compensation Committee
Corporate Sustainable Management
Corporate Governance Operation Status
Communication with Stakeholders
Implementation of Ethical Management
Risk Management Operations
Implementation Status of Intellectual Property Management Plan
Employee Welfare Measures and Implementation Status
Communication between Independent Directors, Internal Audit Officer, and CPA
Management measures
Internal Audit Responsibilities
Corporate Sustainability
Sustainability Report
Greenhouse Gas Inventory Report
Energy Management
Employee Benefits
Public Welfare Activities
IR Contact
Stakeholder Engagement
Investor Relations
Column
Contact Us
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Post UV Machine
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PCB and IC Substrate
Precision Hot Air Oven
Vacuum Oven
Hot Air Conveyor Oven
UV Curing Machine
IR Curing Oven
Coating Machine
Exposure Machine
Vacuum Laminator
Line Integration
Other
TGV and Advance Packaging
Glass Substrate-TGV
FO WLP/FO PLP
Automatic Baking System
Hot Plate Oven and VCD Unit
Dip Coater
Vacuum Laminator
Post UV Machine
Peeler
LCD and Optical Process
Precision Hot Air Oven
Vacuum Oven
Hot Air Conveyor Oven
Hot Plate Conveyor Oven
IR Curing Oven
Robot Baking System
UV Curing Machine
Coating Machine
Exposure Machine
Line Integration
FPC and Roll to Roll
Roll to Roll Curing Line
Roll to Roll Laminating Line
Roll to Roll Exposing Line
Roll to Roll Coating Line
Roll to Roll Printing Curing Line
Roll to Roll Leveling Machine
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Post UV Machine
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